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The MC-TDX waterblock is designed to provide optimum performance to the Multi-Core and Multi-Die processors currently on the market and soon to be released products.
Features: - 100% copper 110 material - Acrylic and brass top options - Threaded fitting ports are G 1/4 BSPP for use with any similar spec fittings. - Complete Block with O-Ring - Pressure Tested to 50psi - Fittings sold separately - Machine lapped and flat mirror polished - Stainless steel hold down
Benefits: - 240 Heat Dissipating Columns for enhanced transfer of heat to the water and optimum coverage of the CPU - Significant temperature drops on Quad Core and multiple die processors. (5-10 Degrees Celsius observed on lab QX6800 processors depending on radiator size and ambient room temperature) - Ready to install designed and tuned for your system for top performance - Anti-Tarnish coating applied to prevent finger print or environmental changes. This specialized formula also has no affect on cooling potential. - Corrosion will not occur when used with other Copper and Brass parts. Avoid using non-anodized aluminum (or all aluminum) if at all possible for maximum component life.
Notes: - Verify proper mount before power up. Check the thermal compound imprint and verify the block isn't touching any capacitors. - Optional backplate is 1/8" acrylic and covers the Intel Backplate. A gasket surround the Intel backplate for additional protection.
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